考研英語(yǔ)時(shí)文賞讀（74）：蘋果擲重金與高通達(dá)成和解

　　摘要：考研英語(yǔ)作為一門考研公共課，雖然大家都學(xué)了英語(yǔ)十幾年，卻仍經(jīng)常有總分過(guò)線掛在英語(yǔ)上的情況，因此英語(yǔ)復(fù)習(xí)不單單是單詞、做題。閱讀作為考研英語(yǔ)的大頭，僅僅做考研真題或許沒(méi)法滿足你的閱讀量，因此幫幫之后會(huì)不定時(shí)推出一篇英文美文，這些文章都與考研英語(yǔ)閱讀同源，多讀必有好處。

　　Qualcomm Inc will receive at least $4.5 billion as part of a legal settlement with Apple Inc that ended more than two years of wrangling over the chip maker’s patent-licensing fees, the company said Wednesday.

　　高通公司周三表示，作為與蘋果公司達(dá)成的一項(xiàng)訴訟和解的一部分，高通將獲得至少45億美元和解金，該和解協(xié)議結(jié)束了雙方圍繞高通專利許可費(fèi)長(zhǎng)達(dá)兩年多的糾紛。

　　The payment—part of a three-pronged settlement between the companies last month—would range from $4.5 billion to $4.7 billion, based on how the accounting ultimately works out, Qualcomm Chief Executive Steve Mollenkopf said in an interview with The Wall Street Journal.

　　高通首席執(zhí)行長(zhǎng) Steve Mollenkopf 在接受《華爾街日?qǐng)?bào)》采訪時(shí)表示，這筆和解金將在45億到47億美元之間，具體取決于最終的會(huì)計(jì)核算方式。該筆付款是高通與蘋果公司上個(gè)月達(dá)成的三方面和解的一部分。

　　The payment was a crucial element of a deal with Apple that settled a dispute threatening to upend Qualcomm’s business model, which combines a chip-making arm and a patent-licensing division that collects royalties from companies that use its technology.

　　高通與蘋果公司達(dá)成的一項(xiàng)和解協(xié)議化解了一樁可能顛覆高通業(yè)務(wù)模式的爭(zhēng)端，而這筆付款是該和解協(xié)議的一個(gè)關(guān)鍵部分。高通的業(yè)務(wù)模式主要包括芯片生產(chǎn)部門和專利授權(quán)部門，后者向使用其技術(shù)的公司收取特許使用費(fèi)。

　　The payment also was to settle prior disputes with Apple’s contract manufacturers, a group of largely Taiwan-based companies that build iPhones, Qualcomm said.

　　高通表示，這筆和解金還將解決之前高通與蘋果公司的代工企業(yè)之間的糾紛；這些代工企業(yè)大多是為蘋果公司生產(chǎn) iPhone 的臺(tái)灣廠商。

　　In forging the agreement, the companies settled on a six-year licensing deal and a multiyear agreement for Qualcomm to supply Apple with modem chips—tiny wafers of silicon that handle communications with cell towers.

　　在達(dá)成和解時(shí)，蘋果公司與高通公司達(dá)成了一項(xiàng)為期六年的授權(quán)協(xié)議，以及一項(xiàng)高通為蘋果公司供應(yīng)調(diào)制解調(diào)器芯片的多年協(xié)議。調(diào)制解調(diào)器芯片是手機(jī)上的一種微型芯片，專門用來(lái)處理手機(jī)與基站之間的通訊。

　　Qualcomm got another piece of good news right after the agreement, when Apple’s current modem supplier, Intel Corp , suddenly said it would bow out of the race to make 5G modems—something Mr Mollenkopf said he hadn’t expected.

　　在上述和解協(xié)議宣布后，高通還迎來(lái)了另一個(gè)好消息，蘋果公司現(xiàn)有調(diào)制解調(diào)器供應(yīng)商英特爾突然宣布退出5G調(diào)制解調(diào)器的競(jìng)爭(zhēng)。Mollenkopf 稱這出乎他的意料。

　　“We really were surprised by that as much as anybody else,” he said. “We really focus on what we can control, and as you know, this is probably the most competitive chip industry in the world and everyone’s trying to get a piece.”

　　他說(shuō)：“我們對(duì)于這個(gè)消息真的跟所有人一樣意外。我們專注于我們可以控制的領(lǐng)域，如你所知，這可能是全球競(jìng)爭(zhēng)最激烈的芯片行業(yè)，每家公司都想分一杯羹。”

　　(全文共251個(gè)詞，華爾街日?qǐng)?bào)，標(biāo)紅為考研重難點(diǎn)詞匯)

?重難點(diǎn)詞匯：

wrangle [?ræ?ɡ?l] n. 爭(zhēng)論；吵嘴 vi. 爭(zhēng)論；爭(zhēng)吵 vt. 爭(zhēng)論；爭(zhēng)吵；辯駁

ultimately ['?lt?m?tl?] adv. 最后；根本；基本上

dispute ['d?s'pj?t] vt. 辯論；懷疑；阻止；抗拒 vi. 爭(zhēng)論 n. 辯論；爭(zhēng)吵

forge [f?rd?] v. 鍛造，鑄造；締造；偽造；穩(wěn)步前進(jìn) n. 鍛造車間；鐵匠鋪；偽造者

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